TSV chip samsung 썸네일형 리스트형 TSV technology used in new Samsung chip TSV technology used in new Samsung chip Nov 27,2015 Samsung’s 128-gigabyte module. [SAMSUNG ELECTRONICS] Samsung Electronics has started mass production of the 128-gigabyte dynamic random access memory (DRAM) modules for enterprise servers using three-dimensional “through silicon via” (TSV) package technology for the first time in the industry. The TSV-based chip can significantly boost signal t.. 더보기 이전 1 다음